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SMT assembly (Surface Mount Technology) – method of mounting electronic components (SMD) on a printed circuit board (PCB). Components for such mounting are characterised by small dimensions, flat housings and soldering terminals in the form of flanges encompassing the ends of the housing. Surface mount assembly is usually carried out using automatic assembly machines.

The SMT assembly consists three production lines.

 

Line I consists of the following equipment:

  • Yamaha screen printer
  • Yamaha automatic assembly machine
  • Yamaha automatic assembly machine
  • Yamaha automatic assembly machine
  • ERSA Hotflow

The line is completed by REECO, ASYS and Oubel conveyors, loading and unloading banks.

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Line II consists of the following equipment:

  • Yamaha screen printer
  • Automatic assembly machine
  • Automatic assembly machine
  • Automatic assembly machine
  • ERSA Hotflow oven

The line is completed by Oubel conveyors, loading and unloading banks.

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Line III consists of the following equipment:

  • Ersa Versaprint screen printer
  • Yamaha automatic Pick&Place machine
  • Yamaha automatic assembly machine
  • Yamaha automatic assembly machine
  • Ersa Hotflow oven

The line is completed by Oubel conveyors, loading and unloading banks.

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THT (Through Hole Technology) components assembly – for projects with more THT solder points, selective soldering technology in nitrogen protection is used. Recently, selective soldering technology has been gaining popularity. Thanks to the use of miniature soldering nozzles, the need to heat the entire PCB surface is eliminated. Selective soldering spot assembly of THT components. The selective soldering process is fully controlled and the movement of the PCB and the individual phases of the process of soldering are programmed.

 

The THT includes the following selective assembly devices:

 

  • Inter Select
  • Inter Select
  • Ersa Smartflow
  • Ersa Versaflow – complete with loading and unloading banks
  • Reeco soldering robot

Complementary assembly of THT components is performed using a manual soldering station. In addition, the machine park is equipped with a selective coating system and a superwash machine.

 

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ersa smartflow
versaflow
myjka

Assembly Quality Control Depending on customer requirements, circuits and components are manufactured to IPC-A-610G Class II or III. Electronic packages after the assembly process are visually inspected using digital microscopes and in the process of automatic optical inspection using the Marantz system.

The execution of the cutting-out process as well as the design process is carried out according to the requirements specified in Standard IPC7525A.

Throughout the process, considerable emphasis is placed on ESD standards and on how products are stored and transported.